Dongguan Xinghang Precision Electronic Packaging Co., Ltd.
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Dongguan Xinghang Precision Electronic Packaging Co., Ltd.

Contact: Manager Yang

Contact mobile phone: 18926828070

Contact number: 0769-83995890

Contact Fax: 0769-83995893

E-mail: sale@dgsinhong.com

Company Address: Huangzhuyuan Industrial Zone, Maiyuan Village, Changping Town, Dongguan City

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How to determine the spacing of electronic components carrier tape?

In the electronics industry, the electronic component carrier tape is like a car box containing goods. Carrier tape also plays such a role in production. Everyone knows that if a car does not have a box for the goods, the so-called transportation is worthless. If the carrier tape is not molded, it will not be packaged, and the product cannot be protected and loaded. The electronic component carrier tape carries the automated production of the electronics industry, and is also the packaging and carrier of electronic components. This position is irreplaceable. So how to determine the spacing of the carrier tape? Let's take a look at the small face:

P1: The distance between the center holes of two adjacent forming slots shows that the increasing law of P1 is a multiple of 4; Determine the horizontal and vertical device direction of the component; Measure the horizontal (A0) data of the component, for reference only. Size data (A0) 3.2mm below 3.2mm 3.2mm--5.5mm 5.5mm--10.5mm 10.5mm--13.5mm 13.5mm--17.5mm 17.5mm--21.5mm 35.5mm--47.5mm 25.5mm--28.5mm 28.5mm--32.5mm 32.5mm--36.5mm 36.5mm--40.5mm. Suitable pitch (P1) P1=4mm P1=8mm P1=12mm P1=16mm P1=20mm P1=24mm P1=28mm P1=32mm P1=36mm P1=40mm P1=44mm.

The "reinforcement rib" design of the carrier tape slot can reach a molding depth of 30 mm, is not easy to deform, the compressive strength reaches 63 MPa, and the shrinkage rate (60/85% pH) is 0.1%. The professional mold design and molding process enable the carrier tape to be folded at 180 degrees for 5 times without breaking marks, which completely solves the problem of insufficient toughness and easy fracture of the product. Carrier tape production adopts back blow molding technology to ensure that the groove size of the carrier tape is accurate to 0.05 mm, and the "R" angle size is 0.1 mm, which can be accurately formed without blocking the material.

There are two main types of materials for the carrier tape: plastic (polymer) and paper. The embossed carrier tape is mainly composed of plastic materials. The mainstream in the market is polycarbonate carrier tape, polystyrene and acrylonitrile-butadiene-styrene copolymer carrier tape. In addition, there are some carrier tapes made of polyester, APET and other materials. The stamping carrier tape is mainly made of paper material or polyethylene composite material. The purpose of the carrier tape can be divided into: integrated circuit dedicated carrier tape, transistor dedicated carrier tape, chip-level light-emitting diode dedicated carrier tape, chip-level inductor dedicated carrier tape, integrated chip carrier tape, chip-level capacitor dedicated carrier tape, and patch Special carrier tape for type connectors, etc.

The above explanation is to determine the method of determining the carrier tape spacing of electronic components. I hope it will be helpful to you after reading it. If you want to know more about electronic components carrier tape, please contact customer service online or call this Company service hotline (upper right corner of the website) for consultation, we will be happy to provide you with quality service!